JPH0543773B2 - - Google Patents
Info
- Publication number
- JPH0543773B2 JPH0543773B2 JP447389A JP447389A JPH0543773B2 JP H0543773 B2 JPH0543773 B2 JP H0543773B2 JP 447389 A JP447389 A JP 447389A JP 447389 A JP447389 A JP 447389A JP H0543773 B2 JPH0543773 B2 JP H0543773B2
- Authority
- JP
- Japan
- Prior art keywords
- liquid phase
- phase diffusion
- less
- diffusion bonding
- alloy
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
- B23K35/22—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by the composition or nature of the material
- B23K35/24—Selection of soldering or welding materials proper
- B23K35/30—Selection of soldering or welding materials proper with the principal constituent melting at less than 1550 degrees C
- B23K35/3033—Ni as the principal constituent
Landscapes
- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Pressure Welding/Diffusion-Bonding (AREA)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP447389A JPH02185940A (ja) | 1989-01-11 | 1989-01-11 | 酸化雰囲気中での接合が可能な液相拡散接合用合金箔 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP447389A JPH02185940A (ja) | 1989-01-11 | 1989-01-11 | 酸化雰囲気中での接合が可能な液相拡散接合用合金箔 |
Publications (2)
Publication Number | Publication Date |
---|---|
JPH02185940A JPH02185940A (ja) | 1990-07-20 |
JPH0543773B2 true JPH0543773B2 (en]) | 1993-07-02 |
Family
ID=11585089
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP447389A Granted JPH02185940A (ja) | 1989-01-11 | 1989-01-11 | 酸化雰囲気中での接合が可能な液相拡散接合用合金箔 |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPH02185940A (en]) |
Cited By (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2008119744A (ja) * | 2006-01-31 | 2008-05-29 | Nippon Steel Corp | 液相拡散接合用合金 |
JP2015508450A (ja) * | 2011-12-23 | 2015-03-19 | コミッサリア ア レネルジー アトミーク エ オ ゼネルジ ザルタナテイヴ | 高い炭素含有量を有するスチールから作製される部品と、低い炭素含有量を有するスチール又はニッケル合金から作製される部品とを、拡散溶接によって結合するためのプロセス:対応するアセンブリ |
CN110666328A (zh) * | 2019-11-01 | 2020-01-10 | 西安西工大超晶科技发展有限责任公司 | 一种铸造高温合金与马氏体不锈钢扩散焊方法 |
Families Citing this family (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2820613B2 (ja) * | 1994-03-29 | 1998-11-05 | 新日本製鐵株式会社 | 酸化雰囲気中で接合可能な耐熱材料用液相拡散接合合金箔 |
US5919577A (en) * | 1996-06-04 | 1999-07-06 | Nippon Steel Corporation | Fe-based alloy foil for liquid-phase diffusion bonding of Fe-based materials by enabling bonding in oxidizing atmospheres |
JP3243184B2 (ja) | 1996-07-12 | 2002-01-07 | 新日本製鐵株式会社 | 酸化雰囲気中で接合可能な液相拡散接合用合金箔 |
JP5579910B1 (ja) * | 2013-09-30 | 2014-08-27 | 株式会社日立パワーソリューションズ | 減温管 |
CN106460130A (zh) * | 2014-06-26 | 2017-02-22 | 日立金属株式会社 | 硬钎焊用Ni基非晶合金薄带、使用其的不锈钢制接合物 |
-
1989
- 1989-01-11 JP JP447389A patent/JPH02185940A/ja active Granted
Cited By (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2008119744A (ja) * | 2006-01-31 | 2008-05-29 | Nippon Steel Corp | 液相拡散接合用合金 |
JP2015508450A (ja) * | 2011-12-23 | 2015-03-19 | コミッサリア ア レネルジー アトミーク エ オ ゼネルジ ザルタナテイヴ | 高い炭素含有量を有するスチールから作製される部品と、低い炭素含有量を有するスチール又はニッケル合金から作製される部品とを、拡散溶接によって結合するためのプロセス:対応するアセンブリ |
CN110666328A (zh) * | 2019-11-01 | 2020-01-10 | 西安西工大超晶科技发展有限责任公司 | 一种铸造高温合金与马氏体不锈钢扩散焊方法 |
Also Published As
Publication number | Publication date |
---|---|
JPH02185940A (ja) | 1990-07-20 |
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Legal Events
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